发明名称 Method for producing an integrated circuit product having a polyimide film interconnection structure and product fabricated thereby.
摘要 <p>A method for making integrated circuits in which a polyimide/conductor multilevel film (17) is cast on a substrate (10), using available or existing semiconductor processing equipment. The polyimide film (17) is formed from readily available polyamic acid resins, and the conductor (16) can be sputtered aluminium formed to interconnection conductor patterns (16, 16') by standard photolithographic techniques. After fabrication of the multilayer film (17), the conductors (16, 16') of the film (17) and the device circuit (30) are brought into aligned contact, and the device circuit (30) affixed to the film (17). The film (17) and the device circuit (30) are then removed from the substrate (10) for further processing, such as bonding the device and film to a mother board or leadframe, as desired.</p>
申请公布号 EP0232533(A2) 申请公布日期 1987.08.19
申请号 EP19860117768 申请日期 1986.12.19
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 WILSON, ARTHUR M.
分类号 H01L21/768;H01L21/48;H01L23/522;H01L23/538;H05K1/03;H05K1/14;H05K3/00;H05K3/20;H05K3/46;(IPC1-7):H01L21/48;H01L23/52 主分类号 H01L21/768
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