HEAT CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, HEAT CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-SHAPED MOLDED PRODUCT, METHODS FOR PRODUCING THEM, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a heat conductive pressure-sensitive adhesive sheet having low hardness, excellent flexibility and shape followability and excellent heat resistance.SOLUTION: There is a heat-conductive pressure-sensitive adhesive sheet-shaped molded product obtained by the polymerization reaction of at least a (meth)acrylic acid ester monomer (α1) and a polyfunctional monomer (α2) after or while molding a mixed composition, which comprises 100 pts.mass of a (meth) acrylic resin composition (A) containing a (meth)acrylic acid ester polymer (A1), a (meth)acrylic acid ester monomer (α1) and 0.2 mass% or more and 3 pts.mass or less of a polyfunctional monomer (α2) and 5 pts.mass or more and 100 pts.mass or less of a plasticizer (C) which is at least one selected from the group consisting of a predetermined aliphatic dicarboxylic acid ester and a predetermined trimellitic ester and 150 pts.mass or more and 600 pts.mass or less of a thermally conductive filler (E), into a sheet-like shape.SELECTED DRAWING: Figure 1