| 摘要 |
PURPOSE:To obtain a semiconductor device having high reliability by bending the end of lead at the side of a pellet in a molding resin, and providing it to surround the side of the pellet to alleviate a stress to the pellet due to thermal expansion. CONSTITUTION:The ends of inner leads 15 at the side of a bed 12 are so bent downward as to surround the side of a pellet 13, and wirings 14 are connected on a bending point. The entirety is sealed with epoxy resin 16 except the surface on which no pellet 13 of a heat sink plate 11 is placed. The ends of the leads 15 bend downward become stoppers for the resin 16. Thus, even if the resin and the bed 12 are thermally expanded due to heat applied from exterior or heat generated from the interior of the pellet, a stress due to the external resin is not affected directly to the pellet. Thus, it can prevent the characteristics of a semiconductor circuit from varying due to the stress and the pellet from cracking. |
