A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE MASTER SLICE TECHNIQUE

摘要

A method of manufacturing a semiconductor device using the master slice technique includes the formation of both an N-channel MIS field effect transistor Tn2 and a P-channel MIS field effect transistor Tp2 in a final output stage of the device. Then during the customising step an output wire LI is connected to the drain of only one of the N-channel MIS field effect transistor Tn2 and the P-channel MIS field effect transistor Tp2 to form an integrated circuit of an N-channel open-drain output type or a P-channel open-drain type. This enables the output type to be chosen to suit the particular circuit prepared by the customising step using only simple processing and very quickly.