| 摘要 |
PURPOSE:To obtain a resin composition low in stress and excellent in moisture resistance, thermal cycling resistance, etc., by mixing an epoxy resin with a novolak phenolic resin, a hydrogenated polyisoprene rubber and an inorganic filler at a predetermined weight ratio. CONSTITUTION:The purpose sealing resin composition is prepared by mixing an epoxy resin (A) (e.g., cresol novolak epoxy resin), a novolak phenolic resin (B), 0.1-10wt% hydrogenated isoprene rubber (C) (e.g., rubber of the formula) and 25-90wt% inorganic filler (D) (e.g., silica powder or alumina powder) as essential components together. It is suitable that the ratio by equivalent of the epoxy groups of component A to the phenolic hydroxyl groups of component B is in the range of 0.1-10. By using this sealing resin composition, electronic or electric components of high reliability can be obtained.
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