| 摘要 |
PURPOSE:To enable a polyimide pattern superior in heat resistance, dimensional stability, electrical and mechanical properties to be formed easily and sharply with high precision by using a composition of the polyimide soluble in an organic solvent containing a specified azido compound. CONSTITUTION:The polyimide film is formed by using the organic solvent- soluble photosensitive polyimide composition composed of the organic solvent- soluble aromatic polyimide made of the polycondensate of a biphenyltetracarboxylic acid component and an organic diamine component, and the aromatic azido compound. This polyimide film is exposed to light having a specified pattern and developed with a developing solution composed of one or more kinds of first compound group, such as monoethanolamine, hydrazine, CnH2n+1-NH2 (n is integer of >=3), or NH2-CnH2n-NH2 (n is an integer of >=2) or a developing solution composed of one or more kinds of the first compound group, water, and one or more kinds of second alcohol type compound group. |
