发明名称 |
FORFARANDE OCH ANORDNING FOR BESTEMNING AV STRUKTURBILDNINGSKINETIKEN OCH ADHESIONSEGENSKAPERNA HOS BINDEMEDEL |
摘要 |
A method for monitoring structural changes in a binder in contact with a solid object, while the binder is curing. Conductivity measuring pick-ups are placed in the binder mass and at the boundary between the binder and the solid object. A low amplitude AC voltage is applied to each pick-up at a low frequency, and the pick-up output signals are compared by a differential inductive bridge. The difference between the output signals is indicative of the extent of adhesion of the binder to the solid object. Preferably, only those components of the pick-up signals which are in phase with the applied AC voltage are employed for the comparison. |
申请公布号 |
SE453332(B) |
申请公布日期 |
1988.01.25 |
申请号 |
SE19820001700 |
申请日期 |
1982.03.17 |
申请人 |
LEGORNY I IM G V PLECHANOVA;PROIZV GEOL OB TSENTR RAIONOV |
发明人 |
1)I L * EBERLING;2)L A * TERESCHENKO;3)N I * NIKOLAEV;4)A M * YAKOVLEV;5)V I * KOVALENKO;6)N K * LIPATOV;7)R A * TATEVOSIAN;8)M Y * TITOV |
分类号 |
G01N27/06;E21B47/00;G01N11/00;G01N19/04;G01N27/04;G01N33/38;(IPC1-7):G01N27/04 |
主分类号 |
G01N27/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|