Induction heating for underfill removal and chip rework

摘要

Underfill materials and methods for removing an underfill material from beneath a chip in relation to removal of the chip from a substrate. The underfill material may a plurality of particles dispersed in a bulk matrix. The material constituting the particles may be capable of generating heat energy when exposed to a time-varying magnetic field. The bulk matrix of the underfill material between the chip and a substrate may be heated with heat energy transferred from the particles. While heated, the underfill material is removed. The heating of the underfill material may also be used to heat solder bumps connecting the chip with the substrate so that the solder bumps are liquefied.

主权项

1. A method for removing an underfill material from beneath a chip, the method comprising:
heating the underfill material with induction heating; and while the underfill material is heated, removing the underfill material from beneath the chip.