| 摘要 |
PURPOSE:To selectively cut a thin film layer of a composite photocell by so coupling an ultrasonic energy and a spark discharge energy to be able to be applied, and contacting a cutting blade with a thin film layer in the state that at least one is applied to a cutting tool to be relatively moved. CONSTITUTION:A cutting blade at the end of a cutting tool 54 is suppressed by a support 51 to an insulating substrate 1, and a thin film layer on the substrate is pulverized or evaporated by heating to be separated by either one or both of ultrasonic and electric energies. In a thin film photocell, a first electrode layer made of a thin transparent film layer of SnO2 film is formed on the substrate 1, and ultrasonic and electric energies are applied to the layer of SnO2 to be cut while pressing a cutting tool 54 under a predetermined pressure. Then, a semiconductor layer made of amorphous silicon is formed on the first electrode layer, an ultrasonic energy is applied, cut, a second electrode layer made of a thin metal film or ITO thin film is formed on the semiconductor layer made of an amorphons silicon, and cut. Then, only the thin film layer to be cut can be selectively cut without damaging the base in response to mechanical and electrical characteristics of the thin film layer and the base. |
