Heat-curable mixture containing substituted bicyclo (2.2.1) hept-5-ene-2,3-dicarboximide and polymaleimide, and ethylenically unsaturated phenolic compound

摘要

Heat-curable mixtures comprising (a) 10-90% by weight of at least one compound of formula I <IMAGE> (I) (b) 90-10% by weight of at least one compound of formula II <IMAGE> (II) and, based on the sum of (a)+(b), (c) 0-30% by weight of at least one compound which is able to react with component (b), in which formulae above n, m, R, R', R1, R2 and R3 are as define in claim 1, are suitable for the preparation of moulded articles such as prepregs and composites, coatings and bonds.