Process for producing a ceramic multi-layer circuit board

摘要

This invention provides a ceramic multi-layer circuit board wherein electroconductive patterns and ceramic insulating layers are piled alternately, characterized in that each ceramic insulating layer is a sintered product comprising one or more kinds of silica and a glass. Since the glass has a softening point lower than the melting point of the material of the electroconductive patterns, it enables sintering of the ceramic multi-layer circuit board at low temperatures. The silica is effective for reduction of the dielectric constant of each ceramic insulating layer.