| 摘要 |
In order to arrange and fit integrated memory circuits (3) on printed circuit boards (1, 2) such that the previously achieved memory capacity per unit volume is increased by a multiple, the integrated circuits (3), which are constructed as semiconductor memories, are arranged in rows between two printed circuit boards (1, 2) which are aligned parallel to one another and spaced apart, and are linked to one another electrically via conductor tracks (4, 5) which run on the printed circuit boards (1, 2). In consequence, a memory capacity per unit volume is achieved which is increased by a factor of 8 in comparison to fitting integrated memory circuits using SMD technology. A plurality of high-capacity memory blocks (10) can be combined to form a unit. <IMAGE>
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