发明名称 Insert for liquid phase diffusion bonding.
摘要 <p>Insert l comprises thin substrate (2) made by cold-rolling, and two bonding alloy layers (3) formed by plating on the upper and lower surfaces of substrate (2), respectively. Both layers (3) are extremely thin, and are made of an alloy having a melting point lower than that of substrate (2). Insert(l)is used to achieve liquid phase diffusion bonding of first and second base metals (4, 5). Insert(l)is interposed between first base metal (4) and second base metal (5). Then, insert (l)and base metals (4, 5) are clamped together with a pressure of, for example, 50 bar, and are placed in an atmosphere of a low pressure of about l0&lt;-&gt;&lt;4&gt; Torr and heated to the melting point of alloy layers (3) or to a temperature above this melting point but below the melting points of substrate and plates (4, 5).</p>
申请公布号 EP0278030(A1) 申请公布日期 1988.08.17
申请号 EP19870101827 申请日期 1987.02.10
申请人 NIPPON KOKAN KABUSHIKI KAISHA 发明人 UENO, YASUHIRO C/O PATENT DIVISION;KAGECHIKA, HIROSHI C/O PATENT DIVISION;WATANABE, ITARU C/O PATENT DIVISION;KOSUGE, SHIGEYOSHI C/O PATENT DIVISION;KOJIMA, TOSHIFUMI C/O PATENT DIVISION
分类号 B23K35/02;B23K35/30;(IPC1-7):B23K35/02;B23K35/32 主分类号 B23K35/02
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