发明名称 |
SYSTEME POUR LA GALVANOPLASTIE DE DISPOSITIFS SEMI-CONDUCTEURS MOULES |
摘要 |
A system for electroplating metals, such as tin and solder on semiconductor lead frame strips includes a magazine for carrying the lead frames and a separate plating rack for carrying the magazines. The plating rack, which has an insulated surface, includes means for directing a current to the lead frame strips when the magazine is inserted in the plating rack. An electric coupling means is also provided for assuring that the current from the plating rack is evenly distributed among the individual lead frame strips so that uniform plating results. The magazine is suitable for transporting and storing the lead frame strips during assembly of semiconductor components, and it is unnecessary to remove the lead frame strips from the magazine for mounting on the plating rack. |
申请公布号 |
FR2589886(B1) |
申请公布日期 |
1988.08.26 |
申请号 |
FR19860011539 |
申请日期 |
1986.08.08 |
申请人 |
NATIONAL SEMICONDUCTOR CORP |
发明人 |
HEM P. TAKIAR ET JAGDISH BELANI;BELANI JAGDISH |
分类号 |
C25D7/00;C25D17/06;C25D17/08;H01L21/50;H01L23/48;H01L23/50;(IPC1-7):C25D19/00;H01L21/68 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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