发明名称 |
Process for metal plating of substrates. |
摘要 |
<p>A process for additively metal plating a substrate wherein the adhesion to said substrate is improved by treating the surface with a sol-gel thin film comprising an alkoxysilane and preferably also comprising a transition metal compound which is then activated to provide catalytic seeds for the plating step. The process is of particular importance for printed circuit boards.</p> |
申请公布号 |
EP0280918(A2) |
申请公布日期 |
1988.09.07 |
申请号 |
EP19880101693 |
申请日期 |
1988.02.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MUKHERJEE, SHYAMA PRASAD;SAMBUCETTI, CARLOS JUAN;SERAPHIM, DONALD PHILIP |
分类号 |
C23C18/18;C23C18/28;H05K3/38 |
主分类号 |
C23C18/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|