TECHNIQUES FOR DEVICE-TO-DEVICE COMMUNICATIONS

摘要

Embodiments of the present disclosure provide apparatuses and systems for proximity communications. The apparatus may include an integrated circuit (IC) package with a central processing unit (CPU) circuit, an input-output (I/O) circuit coupled with the CPU circuit, and a dielectric electromagnetic waveguide coupled with the I/O circuit, to enable communications between the CPU circuit and another apparatus. In another instance, the apparatus may include a plurality of coupler pads disposed on a first surface of the apparatus; and a processor electrically coupled with the coupler pads. One of the coupler pads may form capacitive coupling with one of coupler pads disposed on a second surface of another apparatus, in response to a placement of the first surface in at least partial contact with the second surface, to enable proximity data communication between the processor and the other apparatus. Other embodiments may be described and/or claimed.