WAVE RESISTANCE-ADAPTED CHIP SUPPORT FOR A MICROWAVE SEMICONDUCTOR

摘要

1. Chip support for microwave components having at least one support which is electrically conductive in a single area, having at least one dielectric substrate which is provided with conductive surfaces and with at least one recess into which at least one active or passive microwave component is inserted, characterized in that the recess (3) in the dielectric substrate (1) is matched in shape and size to the requirements of the microwave component, that the dielectric substrate (1) rests on the support (2) which is electrically conductive in a single area, that the microwave semiconductor component (4) is inserted in the recess (3) of the dielectric substrate (1), that the earth connections (11) of the microwave semiconductor component (4) within the recess (3) are connected to the electrically conductive area of the support (2), which is located underneath the recess concerned (3), that the dielectric substrate (1) exhibits in the area in which it rests on the support (2) greater dimensions than the electrically conductive area of the support (2), that the electrically conductive surfaces on the dielectric substrate (1) are microwave striplines (5) and that these microwave striplines (5) exhibit thickened and/or widened sections (6) where the dimensions of the dielectric substrate (1) project over the dimensions of the electrically conductive area of the support (2), for electrical matching to external materials onto which the chip support will be placed later.