| 摘要 |
An epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation (embedding) of electrical components, in particular ferrite annular-core inductors, interference suppression filters and the like, having the following composition of its starting components: 100 parts by weight of epoxy resin, 50 parts by weight of curing agent and 235 parts by weight of a Al2O3 as filler, where the filler contains less than 0.02% by weight of water-soluble Na2O.
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