| 摘要 |
The purpose of the present invention is to provide an electronic circuit substrate and an electronic control device in which heat resistance, heat dissipation, and low stress are simultaneously realized. This electronic control device has a semiconductor chip provided with wiring terminals on one side thereof, a substrate with wiring terminals that are connected to the semiconductor chip wiring terminals via a first connecting layer, and a heat sink that is connected directly to the semiconductor chip via a second connecting layer, wherein the electronic control device is characterized in that, in the second connecting layer, a region that is 30-70% of the space where the semiconductor chip and the heat sink face one another comprises sintered metal. |
