| 摘要 |
PURPOSE: To simplify manufacturing by forming a chip so that a conductive edge part arranged on the surface of an insulating material can be provided, and electrically isolating the conductive edge part from the semiconductor main body of the chip by the insulating material. CONSTITUTION: An assembly 11 is composed of a detector array part 13, module 15, connector board 17, and pin grid array 27. The detector array part 13 is formed of a detector element 13a, and the module 15 is formed of an integrated circuit layer 15a. Also, each integrated circuit layer constitutes a processing circuit so that each detector element can have an exclusive processor. Then, an input lead 18 from the detector element to an exclusive active circuit part is exposed in the edge part of the layer 15a, and connected with a conductive pad 22 formed on an edge surface 19. Also, conductive areas 25a and 25b of a connector board 17 are electrically connected with the module 15. Thus, the connection of the detector element with the exclusive processing circuit can be easily and exactly attained.
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