| 摘要 |
<p>PURPOSE:To remove shavings caused by a scribing process easily while improving the positional accuracy of scribing by coating a wafer with a photoresist and scribing the wafer. CONSTITUTION:A photoresist 2 is applied onto the surface of a wafer 1, an opening section 4 in the photoresist is formed onto a scribing predetermined line 3, the opening section 4 is flawed 7, the photoresist 2 is gotten rid of, and the wafer 1 is cloven along the scribing line 3. Consequently, shavings 6 caused at the time of scribing can easily be taken off together with the photeresist 2. When the opening section 4 in the photoresist 2 is shaped onto the cleavage predetermined line 3, the opening section 4 is used as a mark having high accuracy at the time of scribing while the positional displacement of scribing can easily be detected.</p> |
