| 摘要 |
A carrier for an integrated circuit chip includes a ceramic substrate (1) having pads (2, 3) on upper and lower surfaces thereof and electrical wirings (4) extending via the substrate and connecting upper and lower pads. The chip (9) is located above the substrate with electrical leads (10) thereon connected to the upper pads. A first metal frame (5) is soldered to the upper surface of the substrate so as to surround the chip, a second metal frame (13) is seam-welded to an upper surface of the first frame and also surrounds the chip, and a plate (11) is soldered to an upper end of the second frame. The chip is adhesively (15) secured to an undersurface of the plate and is therefore sealed within the space defined by the substrate, the first and second frames and the plate. |
