发明名称 |
Low-shrinkage thermosetting resin composition. |
摘要 |
<p>Disclosed herein is a low-shrinkage thermosetting resin composition which comprises a thermosetting resin and a polymer having in its molecule a functional group such as aziridine group, oxazoline group, and epoxy group. It undergoes only a small amount of volume shrinkage at the time of curing. This low shrinkage leads to superior dimensional stability, surface smoothness, and crack resistance. It provides molded articles free of discoloration and having a good surface gloss, without causing mold staining.</p> |
申请公布号 |
EP0333204(A2) |
申请公布日期 |
1989.09.20 |
申请号 |
EP19890104773 |
申请日期 |
1989.03.17 |
申请人 |
NIPPON SHOKUBAI KAGAKU KOGYO CO. LTD. |
发明人 |
MINAMI, KENJI;KAWAMURA, KIYOSHI;KUWAMOTO, TOMOYUKI;IZUBAYASHI, MASUJI;SANO, YOSHINORI |
分类号 |
C08K9/08;C08L61/26;C08L63/10;C08L67/06 |
主分类号 |
C08K9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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