| 发明名称 |
Metallized substrate for electronic device. |
| 摘要 |
<p>Metallizing pastes, for forming thick film circuitry (12) on low expansion substrates (10) in electronic devices, are disclosed. The paste contains a glass powder that crystallizes on firing to a glass-ceramic in which lead titanate is the primary crystal phase.</p> |
| 申请公布号 |
EP0370227(A2) |
申请公布日期 |
1990.05.30 |
| 申请号 |
EP19890119167 |
申请日期 |
1989.10.16 |
| 申请人 |
CORNING INCORPORATED |
发明人 |
FRANCIS, GAYLORD LEE;MARTIN, FRANCIS WILLIS |
| 分类号 |
C03C8/18;B32B18/00;C03C10/00;H01B1/22;H01B5/00;H01B5/14;H01B13/00;H01L23/498;H05K1/09 |
主分类号 |
C03C8/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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