| 摘要 |
1. coating the surface of a substrate (on the pts. where Cu is to be deposited by non electrolytic plating) with a photosensitive resin compsn., which contains (A) 100 (wt.) pts. photopolymerisable mixt. of (A1) 5-00%unsate. cpd (s). contg. terminal methacryloyl gp (s). and (A2) 95-1% unsatd. cpd (s). with terminal acryloyl gp (s)., (B) 0-400 pts. linear high mol. cpd. and (C) 0.5-20 pts. sensitiser or and sensitiser system, which can form a free radical on exposure to actinic radiation, in which (A1), (A2) and (B) have no N attached directly to H atom (s) in the mol.; 2. selective exposure of the coating to actinic radiation and developement to form a negative pattern; and 3. non electrolytic Cu plating, using the resin as plating resist.
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