发明名称 MOLDING DIE FOR EPOXY BONDING
摘要 PURPOSE:To facilitate the mold release of a molded form, and to improve the dimensional accuracy of the molded form by forming a female die body of a metallic material and shaping the surface of the female die of a silicone resin. CONSTITUTION:A female die body is formed of a metallic material 2, and the surface of the female die is shaped of a silicone resin 4, thus acquiring a desired molding die for epoxy bonding. Accordingly, the dimensional accuracy of a molded form can be improved by forming the female die body of the metallic material 2, and the mold release of the molded form is facilitated by shaping the surface of the female die of the silicone resin 4.
申请公布号 JPH02145306(A) 申请公布日期 1990.06.04
申请号 JP19880301651 申请日期 1988.11.28
申请人 IDEC IZUMI CORP 发明人 TSURII YOSHIAKI;TAKAGI TOSHIKAZU
分类号 B29C33/40;B29C33/38;B29L31/34;H01L21/56 主分类号 B29C33/40
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