| 摘要 |
<p>PURPOSE:To increase the number of wiring layers and to constitute this devide rationally by a method wherein a metal film functions as a substratum film of a bump electrode and connection films are connected mutually on a protective film. CONSTITUTION:Connection films 3a to 3d as one layer are arranged and installed on an insulating film 2 covering the surface of a substrate 1; and the films are covered with a protective film 6. Windows leading to the films 3a to 3d are opened; a two-layer metal film 7 (a layer 7a of titanium and a layer 7b of palladium) is applied to the whole surface of the film 6. The palladium is etched mechanically by making use of a photoresist film 10 as a mask; the whole surface is spin-coated with a photoresist film 11; a window is opened; a solder 8a is grown. Then, the film 11 is removed; the titanium is removed completely by making use of the palladium as a mask; the solder 8a is melted from a short time; and a bump electrode 8 is formed. The metal film 7 functions as a substratum film of the electrode 8; and the films 3b and 3d are interconnected on the film 6.</p> |
