| 摘要 |
<p>In a hybrid integrated circuit encapsulation process, each lead array (14) is encompassed by an elongated C-shaped barrier member (17) which clamps onto the portions of the lead array adjacent the substrate (11); that is, opposite sides of a slot (18) in the barrier member grasp opposite sides of the leads. Thereafter, the uncured RTV silicone (15) is dispensed onto the substrate, flows over and encompasses chips (12) mounted on the surface of the substrate and is prevented from flowing along the leads (14) by the C-shaped members (17), each of which, due to its configuration, constitutes a barrier to fluid flow, either along the length of the various leads or over the top of the C-shaped member. In one embodiment, levers may be integrated onto the C-shaped member opposite the substrate to aid in prying open the slot to permit the leads to be easily inserted into the C-shaped member. In another embodiment, the C-shaped member is made of a plastic material, and integrated with an O-shaped member which may be compressed by a pincer instrument so as to open the slot for easy insertion of the leads into the C-shaped member. <IMAGE></p> |
