发明名称 PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a pattern forming method by which a pattern can be formed in a few number of processes.SOLUTION: The method includes steps of: forming a resist pattern on a base film 14; slimming the resist pattern; depositing an etching product produced by etching the base film on a surface of the slimmed resist pattern 15a to form a pinning part 16 having affinity to a first polymer; forming a neutralization film 18 on the etched base film; forming a block copolymer film comprising the first polymer and a second polymer on the pinning part and the neutralization film; subjecting the block copolymer film to a predetermined treatment to perform micro phase separation, and thereby to form a micro phase separation pattern in which a first portion 21 formed of the first polymer and a second portion 22 formed of the second polymer are alternately disposed and the first portion is disposed on the pinning part.SELECTED DRAWING: Figure 3
申请公布号 JP2016173415(A) 申请公布日期 2016.09.29
申请号 JP20150052471 申请日期 2015.03.16
申请人 TOSHIBA CORP 发明人 KIYONO YURIKO
分类号 G03F7/40;B82Y40/00;H01L21/027;H01L21/3065 主分类号 G03F7/40
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