| 摘要 |
<p>PURPOSE:To perform uniformly a work to a semiconductor substrate by a method wherein a holding body, which is exposed in gas discharge, is provided with a housing hole for housing the substrate and at the same time, is provided with holding parts for positioning the peripheral edge of the opening on one side of the housing hole and the main surface of the substrate on the same plane. CONSTITUTION:A holding body 11 holds a semiconductor substrate 13, which is exposed in plasma 12 which is generated by gas discharge during the gas discharge. The body 11 is integrally provided with a housing hole 14 for housing the rectangular substrate 13, for example, and 4 pieces of pawl parts 15, which are respectively used at a holding part, for positioning the peripheral edge (a reference plane) of the opening on one side of the hole 14 and the main surface 13a of the substrate 13 on the same plane. The pawl parts 15 are respectively formed into the form of an inverted truncated cone to protrude toward a plasma generating side of the body 11 and their outside dimensions are set in a sufficiently small size compared to the outside dimension of the substrate 13. In such a way, the plasma which is generated by the gas discharge at the time of work is made uniform and the generation of irregularity of working characteristics to the substrate 13 can be prevented.</p> |
