G-TAB MANUFACTURING PROCESS AND THE PRODUCT PRODUCED THEREBY

摘要

A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made conductive by the electrolytic deposition of a metal on the carbon. The invention is particularly suited for G-TAB wherein a first metal plane is patterned into signal plane circuit traces and a second metal plane is patterned into ground plane traces.