POSITIVE TYPE PHOTOSENSITIVE RESINOUS COMPOSITION

摘要

of the disclosure A positive type photosensitive resinous composition comprising a binder resin and a quinone diazide compound, the binder resin being a copolymer of (a) at least one phosphoric acid ester monomer represented by the formula: (b) at least one acid group containing .alpha.,.beta.-ethylenically unsaturated monomer, and (c) other copolymerizable .alpha.,.beta.-ethylenically unsaturated monomers than (a) and (b), which is specifically useful for the formation of resist coating in the preparation of printed circuit board.