发明名称 |
Contour machining method and apparatus for printed circuit board |
摘要 |
A method of machining the contour of a printed circuit board by effecting a relative feed movement between a rotating tool and the other periphery of the printed circuit board. The electrical current value of a drive motor for driving a spindle to which the tool is attached is detected and an operation is conducted for changing the machining condition in such a manner as to reduce the electrical current value of the spindle drive motor and, at the same time, for changing also tool diameter compensation amount to a value corresponding to the machining condition after the change, at every time the detected electrical current value has reached a predetermined current value immediately before tool breakage and repeatedly by a predetermined number of times.
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申请公布号 |
US5011345(A) |
申请公布日期 |
1991.04.30 |
申请号 |
US19890446588 |
申请日期 |
1989.12.06 |
申请人 |
HITACHI SEIKO CO., LTD. |
发明人 |
NISHIGAI, MASAO;OTANI, TAMIO;KANAYA, YASUHIKO;MURAKAMI, TETSUO |
分类号 |
B23Q15/12;B23B47/24;B23C3/00;B23Q15/00;B23Q17/09;B23Q35/12;G05B19/18;G05B19/404;H05K3/00 |
主分类号 |
B23Q15/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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