Electrical connectors including a row of conductive interconnect elements in the form of slugs which extend through openings in a block of insulating material and which are associated resilient wadded elements to connect conductive pads of circuit boards. A wall portion of conductive material is positioned in parallel relation to the row or elements to provide a ground plane and an air dielectric is provide along the length of each element to cooperate with the dielectric of the block and obtain a desired characteristic impedance.
