| 摘要 |
PURPOSE:To maintain always optimum bonding conditions by equipping it with a recognizing device which checks the workmanship of the bonding conditions after bonding. CONSTITUTION:In addition to the semiconductor device recognizing device 3 for wire bonding, a recognizing device 1 for the bonding condition after bonding is provided, and the bonding condition of a semiconductor device 5 after wire bonding is monitored by this recognizing device, and the information is fed back to the controls of a wire bonding device 2. And the wire bonding device 2 analyzes the fed-back information, and compares it with initial setting condition, and controls the operation of a wire bonding head 4. Hereby, the bonding condition can be preserved to be always optimum, and it becomes possible to prevent the frequent occurrence of defectives. |
