| 摘要 |
PURPOSE:To enhance the performance of heat radiation by equipping a heat radiation plate with a strength which provides capability of flextural deformation with a smaller force than the soldered strength of circuitry parts to a circuit board. CONSTITUTION:A heat radiation plate 17 has a strength, which provides capability of flextural deformation with force smaller than the soldered strength of circuit parts 10 to a circuit board 11. Owing to this provision of flexibility for the heat radiation plate 17, interference with a casing 1 can be avoided by incorporating the plate 17 into the casing 1 upon bending by a small finger or tool prior to the incorporation. Eventual contacting with the casing 1 will cause the heat radiation plate 17 to make plastic or elastic deformation under application of a pressing force from the casing 1, and thereby generation of unreasonable stress is precluded. This process permits use of a heat radiation plate 17 with a large radiating area without stripping the solders from the circuitry parts 10, thus the performance of heat radiation is enhanced. |
