Substrate for packaging a semiconductor device, packaging structure and method.

摘要

A substrate (3) for packaging a semiconductor device (1) having a bump (2) thereon according to the present invention is characterized in that the substrate (3) has an electrode terminal (5) to which the bump (2) is to be connected, the electrode terminal (5) has a recess (4) formed thereon to receive at least a top of the bump (2) and at least a top of the surface of the electrode terminal (5) is covered by a metal layer (6) having a lower melting point than that of the bump (2).