发明名称 |
Method for the preparation of a hot-melt adhesive interconnector |
摘要 |
The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition. Such an interconnector can be prepared by stacking alternately numbers of the above mentioned striped sheets and sheets of the insulating adhesive hot-melt resin one on the other, integrating the stack into an integral block and slicing the block in a plane perpendicular to the running direction of the conductive strips in the conductive sheets. |
申请公布号 |
US5041183(A) |
申请公布日期 |
1991.08.20 |
申请号 |
US19900462040 |
申请日期 |
1990.01.09 |
申请人 |
SHIN-ETSU POLYMER CO., LTD. |
发明人 |
NAKAMURA, AKIO;HAYASHI, OSAMI;TABEI, HIDEKI |
分类号 |
H01R11/01;H01R4/04;H01R13/24;H05K1/18;H05K3/30;H05K3/32;H05K3/36 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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