发明名称 |
SEMICONDUCTOR DEVICE INSULATED REGINE |
摘要 |
An electrically-insulated type semiconductor device to be resin-moulded has a rear surface (BS) which can be set in direct contact with a heat radiation section (200) and a front surface (FS) opposite to the rear surface (BS). This semiconductor device includes a metal lead frame (2-3) having a tip end portion (2*) sandwiched between the resin rear surface (BS) and resin front surface (FS) and a mounting portion (2) on which a semiconductor chip (1) is mounted, and frame supporting holes (8) formed to penetrate from the resin front surface (FS) to the mounting portion (2) of the lead frame (2-3). The frame supporting holes (8) are formed by supporting pins (FP) for positioning the mounting portion (2) of the lead frame (2-3). The frame supporting holes (8) are formed only in the resin front surface (FS), and the lead frame (2-3) is formed in such a shape that a thickness (T2) of resin mould (6*) existing between the resin rear surface (BS) and the tip end portion (2*) of the lead frame (2-3) is set to be larger than a thickness (T1) of resin mould (6*) existing between the resin rear surface (BS) and the mounting portion (2) of the lead frame (2-3). |
申请公布号 |
KR910009419(B1) |
申请公布日期 |
1991.11.15 |
申请号 |
KR19880011977 |
申请日期 |
1988.09.16 |
申请人 |
TOSHIBA |
发明人 |
HOSOMI SADAKI;UNECHUBO GENJI;TACHUMI YOSHIAKI |
分类号 |
H01L23/28;H01L21/56;H01L23/31;H01L23/495 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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