| 摘要 |
A socket for a semiconductor device comprises receiving holes to which lead pins of the semiconductor device are inserted, and conductive coupling portions for connecting the receiving holes and conductive portions of a circuit board. The socket is placed on a circuit board and the conductive coupling portions are connected to the conductive portions of the circuit board to be mounted. The lead pin receiving holes of the socket are formed to be parallel to the surface of the circuit board when the socket is mounted on the circuit board. |
