Electronic device

摘要

An electronic device includes a surface-mounted component and a mounting component on which the surface-mounted component is mounted, the surface-mounted component includes a first bump and a second bump, a cross-sectional area of which in an in-plane direction of a surface facing the mounting component is larger than that of the first bump, on the surface facing the mounting component, the mounting component includes a first pad that is soldered to the first bump and a second pad soldered to the second bump on the surface facing the surface-mounted component, and a ratio of an area of the second pad to the cross-sectional area of the second bump is larger than a ratio of an area of the first pad to the cross-sectional area of the first bump.

主权项

1. An electronic device comprising:
a surface-mounted component; and a mounting component on which the surface-mounted component is mounted, wherein the surface-mounted component includes a first bump and a second bump that are horizontally adjacent to each other, an area of an upper surface of the second bump in an in-plane direction of a surface facing the mounting component is larger than an area of an upper surface of the first bump in the in-plane direction of the surface facing the mounting component, wherein the first bump has a circular cross section in the in-plane direction and the second bump has an elliptical cross section in the in-plane direction, wherein the mounting component includes a first pad soldered to the first bump and a second pad soldered to the second bump on the surface facing the surface-mounted component, and wherein a ratio of an area of a lower surface of the second pad to the area of the upper surface of the second bump in the in-plane direction is larger than a ratio of an area of a lower surface of the first pad to the area of the upper surface of the first bump in the in-plane direction.