Package-in-package using through-hole via die on saw streets

摘要

A semiconductor device includes a first die having top, bottom, and peripheral surfaces. A bond pad is formed over the top surface. An organic material is connected to the first die and disposed around the peripheral surface. A via hole is formed in the organic material. A metal trace connects the via hole to the bond pad. A conductive material is deposited in the via hole. A redistribution layer (RDL) has an interconnection pad disposed over the top surface of the first die.

主权项

1. A semiconductor device, comprising:
a first semiconductor die; an insulating material disposed around a peripheral region of the first semiconductor die including a first surface of the insulating material coplanar with a first surface of the first semiconductor die; a conductive via formed through the insulating material with a side surface of the conductive via coplanar with a side surface of the insulating material; a bond pad formed on the first surface of the first semiconductor die; a conductive trace formed between the bond pad and the conductive via; and a second semiconductor die disposed over the first surface of the first semiconductor die.