Packaged device with additive substrate surface modification

摘要

A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

主权项

1. A method of substrate surface modification, comprising:
providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit comprising a base metal having a die pad and a plurality of contact regions surrounding said die pad; additively depositing an ink comprising a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step in a liquid carrier onto at least one of (i) a region of said die pad and (ii) at least one region of a first of said plurality of contact regions (first contact region), and sintering or curing said ink to remove said liquid carrier to form an ink residue; wherein said additively depositing then said sintering or said curing forms said ink residue in a pattern of islands which maintains at least one non-modified metal surface region on said die pad and at least one non-modified metal surface region on said first contact region; wherein said material comprise a dielectric material, and wherein said pattern of islands is a pattern of plating stop islands, further comprising: plating a metal layer between said pattern of plating stop islands, and removing said pattern of plating stop islands to form a plurality of metal pillars.