发明名称 Plasma processing apparatus.
摘要 <p>A plasma processing apparatus comprises: a first electrode (1) connectable with a plasma generating power source; a second electrode (2) capable of supporting a substrate (6) to be subjected to a plasma-involving surface treatment; a third electrode (3) enclosing a space between the first and second electrodes, all the electrodes being positioned in an evacuatable chamber; and potential control means (10) for controlling the potential of the third electrode. &lt;IMAGE&gt;</p>
申请公布号 EP0470580(A2) 申请公布日期 1992.02.12
申请号 EP19910113216 申请日期 1991.08.06
申请人 CANON KABUSHIKI KAISHA;OHMI, TADAHIRO;APPLIED MATERIALS JAPAN, INC. 发明人 YAMAGAMI, ATSUSHI;OKAMURA, NOBUYUKI;OHMI, TADAHIRO;GOTO, HARUHIRO HARRY;SHIBATA, TADASHI
分类号 C23C14/34;C23C14/35;C23C14/54;C23C16/50;C23C16/509;C23F4/00;H01J37/34;H05H1/02 主分类号 C23C14/34
代理机构 代理人
主权项
地址
您可能感兴趣的专利