<p>A plasma processing apparatus comprises: a first electrode (1) connectable with a plasma generating power source; a second electrode (2) capable of supporting a substrate (6) to be subjected to a plasma-involving surface treatment; a third electrode (3) enclosing a space between the first and second electrodes, all the electrodes being positioned in an evacuatable chamber; and potential control means (10) for controlling the potential of the third electrode. <IMAGE></p>
申请公布号
EP0470580(A2)
申请公布日期
1992.02.12
申请号
EP19910113216
申请日期
1991.08.06
申请人
CANON KABUSHIKI KAISHA;OHMI, TADAHIRO;APPLIED MATERIALS JAPAN, INC.