| 发明名称 |
SEMICONDUCTOR WIRE BONDING AND METHOD |
| 摘要 |
Circuitry is disclosed that includes a first conductive portion of a first die and a first conductive pillar electrically and physically connected to the first conductive portion. The first conductive pillar includes a first conductive pillar surface. A first bond connects the first conductive pillar surface to a first end of a bond wire. |
| 申请公布号 |
US2016379953(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201514749219 |
申请日期 |
2015.06.24 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Thompson Patrick Francis;West Jeffrey Alan;Bonifield Thomas D.;Hsu Fu-Kang;Hsia Ching-Lun |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
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| 主权项 |
|
| 地址 |
Dallas TX US |
