POWER SEMICONDUCTOR PACKAGE DEVICE HAVING LOCKING MECHANISM, AND PREPARATION METHOD THEREOF

摘要

A power semiconductor package device and a method of preparation the device are disclosed. The package device includes a die paddle, a first pin, a second pin, and a semiconductor chip attached to the die paddle. A first electrode, a second electrode and a third electrode of the semiconductor chip are connected to the first pin, the second pin and the die paddle respectively. A plastic package body covers the semiconductor chip, the die paddle, the first pin and the second pin. The first pin and the second pin are located near two adjacent corners of the plastic package body. The bottom surface and two side surfaces of each of the first pin and the second pin are exposed from the plastic package body. Locking mechanisms are constructed to prevent the first pin and the second pin from falling off the power semiconductor package device during a manufacturing cutting process. Portions of the first pin, portions of the second pin, and portions of the plastic package body can be cut off. Therefore, the size of the power semiconductor package device is reduced.

主权项

1. A method of fabricating package devices, the method comprising the steps of:
providing a lead frame comprising a plurality of lead frame units, wherein each lead frame unit comprises a die paddle, a first pin and a second pin and wherein the first pin and the second pin are located adjacent to the die paddle; attaching each of a plurality of semiconductor chips to a respective die paddle of the plurality of lead frame units; connecting a first electrode, a second electrode and a third electrode of each of the plurality of semiconductor chips to the respective first pin, the respective second pin and the respective die paddle of the plurality of lead frame units; forming a plastic package layer covering the plurality of semiconductor chips and the lead frame; and performing a cutting process comprising:
cutting the plastic package layer so as to form a plurality of plastic package bodies; andcutting the lead frame so as to form a plurality of package devices; wherein the first pin and the second pin of each of the package devices are located at two adjacent corners of each of the package devices; wherein a bottom surface, a first side surface and a second side surface of the first pin of each of the package devices are exposed from the plastic package body of each of the package devices; and wherein a bottom surface, a first side surface and a second side surface of the second pin of each of the package devices are exposed from the plastic package body of each of the package devices.