| 摘要 |
PURPOSE:To prevent any break of a semiconductor chip and any sticking of dust to said chip during adjustment by separating a semiconductor chip mounting portion from respective circuit boards for input and output impedance adjustment and also providing surrounding insulation blocks and insulating side walls. CONSTITUTION:A conductive substrate 1 has a projected portion 1a at the center for mounting a device; circuit boards 21 and 22 for input/output impedance adjustment are arranged on the conductive substrate 1 at both the sides of the projected portion 1a; and an insulating block 4 separates and surrounds the projected portion 1a and circuit boards 10 and 11. Also, an electrode 8 is placed on the top surface of the insulating block 4; and an insulating side wall portion 7 is placed on the insulating block 4 including the electrode 8 and separates and surrounds the projected portion 1a and the circuit boards 10 and 11. And a semiconductor chip 2 is mounted on the projected portion 1a and metal fine wires 3 sequentially and electrically connect together the electrode of semiconductor chip 2, the electrode 8 on the insulating block 4 and the circuit patterns 21 and 22 of the circuit boards NO and 11. By doing this, the sticking of dust generated during break and adjustment of the semiconductor chip 2 can be prevented. |
