| 摘要 |
PURPOSE:To get an electronic component to be mounted on a multilayer interconnection board easily and hardly have the deviation in position and to get voids to be rarely left over in the solder by making a notch in the central part and a part of the outer part of a solder connection terminal formed on the multilayer interconnection board. CONSTITUTION:A notch A is made in the central part and a part of the outer part of a solder connection terminal 2 which is formed on a multilayer interconnection board 1. Then, solder is supplied to the solder connection terminal 2 by solder printing or by soldering and the supplied solder is melted into a subsolder 3a. Nextly, an electronic component 4 having a solder connection terminal 5 which is equipped with a subsolder 3b is mounted on the solder connection terminal 2 of the multilayer interconnection board 1. At that time, the subsolder 3b of the solder connection terminal 5 of the electronic component 4 is inserted into the notch A of the solder connection terminal 2 of the multilayer wiring board 1. The subsolders 3a and 3b merge with each other by melting to be a solder joint 3c. Thus, soldering is conducted. |
