| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that, conventional high frequency transceiver circuits need a resistive element with several Ω on a line and can be formed only by a thin film process since high accuracy is required, and thus such a resistive element cannot be formed in an inner layer and a space for surface layer formation is required, so that miniaturization has limitations.SOLUTION: A multi-layer ceramic substrate includes: a plurality of ceramic layers laminated in multi-layers; a plurality of conductor films disposed in the ceramic layers of inner layers and connected at interlayers of the ceramic layers; and a resistance film disposed in the ceramic layers of inner layers and sandwiched in contact with at least two of the conductor films in the plurality of conductor films.SELECTED DRAWING: Figure 1 |
