| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of exerting a function as a barrier for a TiW film even when a thickness of the TiW film on a resin layer is made to be thin.SOLUTION: The electronic component includes: a resin layer 14, located on an insulating film 13; a TiW film 22, located on the resin layer and the insulating film; any one of films of a Cu film 15, an Ag film, a Pd film, a Pt film, a Cr film, Ni film, and Ti film, located on the TiW film; and an Au film 23, located on the any one of the films. The any one of the films has a film thickness thinner than a film thickness of the TiW film.SELECTED DRAWING: Figure 1 |
